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金属学报  2010, Vol. 46 Issue (9): 1115-1120    DOI: 10.3724/SP.J.1037.2010.00146
  论文 本期目录 | 过刊浏览 | 高级检索 |
激光喷射钎料球键合焊点界面组织及其可靠性分析
王晓林1), 李明雨1), 王春青2)
1) 哈尔滨工业大学深圳研究生院 材料学科部, 深圳 518055
2) 哈尔滨工业大学 现代焊接生产技术国家重点实验室, 哈尔滨 150001
MICROSTRUCTURE AND RELIABILITY OF LASER JET SOLDER BALL BONDING SOLDER JOINTS
WANG Xiaolin1), LI Mingyu1), WANG Chunqing2)
1) Department of Materials Science, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055
2) State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001
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摘要 

采用激光喷射钎料球键合技术以及Sn3.0Ag0.5Cu(质量分数, %)无Pb钎料球对厚Au焊盘进行了键合实验. 采用SEM和EDS对焊点界面的微观组织进行了分析. 采用冷热循环处理研究了焊点微观组织的演变及其对接头强度的影响. 结果表明, 由于钎焊过程的热量有限, 导致焊盘上的Au层不能全部溶解到钎料中去, 界面处形成Au+AuSn+AuSn2+AuSn4多层结构, 其中AuSn4呈指向钎料内部的针状. 经过 100 cyc以上冷热循环处理, 界面处针状AuSn4层平坦化, 而残余Au通过固相扩散全部消耗, 并在界面处形成(Au, Ni, Cu, Sn)四元相, 导致焊点强度弱化.

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王晓林
李明雨
王春青
关键词:  激光喷射钎料球键合  界面组织  冷热循环  Sn-Ag-Cu钎料    
Abstract: 

Laser jet solder ball bonding (LJSBB) technology is a special soldering method developed in cooperation by Fraunhofer Ltd and PacTech Ltd in 1998 to fulfill the specific needs in the packaging of micro-electro-mechanical system (MEMS) and other functional micro-devices. However, the metallurgy characteristics and reliability of the solder joint produced by LJSBB has not been broadly reported. In the present paper, the commonly used Au/Ni/Cu soldering pads were bonded by LJSBB with Sn3.0Ag0.5Cu lead free solder. The effect of laser energy on the interfacial microstructure of solder joint was investigated by SEM and EDS. The reliability of solder joints was also evaluated by thermal cycle treatment and strength test. Results show that due to the limited heat provided by laser beam,  the Au layer of the commonly used Au/Ni/Cu soldering pad cannot completely dissolve into solder during LJSBB process, which leads to the formation of multilayered reactive structure of Au+AuSn+AuSn2+AuSn4 in the interface of solder joint. The AuSn4 locates at the most outside of the reactive structure and presents a needle-like shape. In despite of the brittle nature of Au-Sn intermetallics, the as-soldered joints present a comparatively high strength. However, the strength of solder joint decreases significantly after 100 thermal cycle treatment and keeps nearly unchanged after even more thermal cycle treatment. Metallurgy analysis of joint interface reveals that the thermal cycle treatment plays the roles of promoting the dissipation of residual Au in joint interface through solid state inter-diffusion, and leading to the formation of a quaternary phase of (Au, Ni, Cu, Sn) in interface, which results in weakening of LJSBB solder joint.

Key words:  laser jet solder ball bonding (LJSBB)    interfacial microstructure    thermal cycle test    Sn-Ag-Cu solder
收稿日期:  2010-03-26      修回日期:  2010-06-15           出版日期:  2010-09-11      发布日期:  2010-09-11      期的出版日期:  2010-09-11
基金资助: 

国家高技术研究发展计划资助项目2007AA217022

通讯作者:  李明雨    E-mail:  wxlhit@163.com
作者简介:  王晓林, 男, 1975年生, 博士
引用本文:    
王晓林 李明雨 王春青. 激光喷射钎料球键合焊点界面组织及其可靠性分析[J]. 金属学报, 2010, 46(9): 1115-1120.
WANG Xiaolin LI Mingyu WANG Chunqing. MICROSTRUCTURE AND RELIABILITY OF LASER JET SOLDER BALL BONDING SOLDER JOINTS. Acta Metall Sin, 2010, 46(9): 1115-1120.
链接本文:  
http://www.ams.org.cn/CN/10.3724/SP.J.1037.2010.00146  或          http://www.ams.org.cn/CN/Y2010/V46/I9/1115
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