合金元素对中温<strong>Sn-Ag-Cu</strong>焊料互连组织及剪切强度的影响

doi:10.11900/0412.1961.2019.00033

金属学报

2019, Vol. 55

Issue (12): 1606-1614 DOI: 10.11900/0412.1961.2019.00033

研究论文

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合金元素对中温Sn-Ag-Cu焊料互连组织及剪切强度的影响

曹丽华¹,陈胤伯^1,²,史起源¹,远杰^1,²,刘志权^1,^2,³(

)

1. 中国科学院金属研究所沈阳 110016
2. 中国科学技术大学材料科学与工程学院沈阳 110016
3. 中国科学院深圳先进技术研究院深圳 518055

Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder

CAO Lihua¹,CHEN Yinbo^1,²,SHI Qiyuan¹,YUAN Jie^1,²,LIU Zhiquan^1,^2,³(

)

1. Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
2. School of Materials Science and Engineering, University of Science and Technology of China, Shenyang 110016, China
3. Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China

引用本文:

曹丽华, 陈胤伯, 史起源, 远杰, 刘志权. 合金元素对中温Sn-Ag-Cu焊料互连组织及剪切强度的影响[J]. 金属学报, 2019, 55(12): 1606-1614.
CAO Lihua, CHEN Yinbo, SHI Qiyuan, YUAN Jie, LIU Zhiquan. Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder[J]. Acta Metall Sin, 2019, 55(12): 1606-1614.

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摘要:

针对SAC305和改良添加了Ni、Sb、Bi元素的2种焊料及其分别与NiSn、NiAu、NiPdAu 3种镀层器件钎焊形成的互连焊点，采用SEM、EDS、EPMA、TEM、DSC等方法研究了Ni、Au、Pd、Sb、Bi等添加元素对金属间化合物(IMC)种类及厚度、焊料第二相形貌及分布以及焊点剪切强度的影响。结果发现，受Ni元素界面耦合作用的影响，焊点器件侧和印刷电路板(PCB)侧生成的IMC均为(Cu, Ni)₆Sn₅化合物；焊料中Sb、Ni元素减缓IMC生长，因此同一镀层下改良焊料的界面IMC厚度小于SAC305的；镀层中Au元素降低IMC生长速率，而Pd元素促进IMC生长，因此同一焊料下NiPdAu镀层样品的界面IMC厚度最大，而NiAu镀层样品的界面IMC厚度最小；镀层中Au、Pd元素的加入，促进焊料中Ag₃Sn相从弥散颗粒状分布转为网状分布，焊点强度得到提升；焊料中Ag、Cu元素的加入，增加弥散分布的(Cu, Ni)₆Sn₅和Ag₃Sn体积分数，提高焊点剪切强度；焊料中添加Bi元素导致焊料熔点降低，但可析出Bi单质起到弥散强化作用；因此，添加了Ni、Sb、Bi元素的改良焊料的焊点剪切强度，均高于同等条件下SAC305焊点样品的剪切强度。

关键词 ：合金元素, Sn-Ag-Cu焊料, 金属间化合物, 界面形貌, 剪切强度

Abstract：

The eutectic Sn-Ag-Cu (SAC) alloy is the most widely used solder alloy in consuming electronic devices owing to its good wettability and mechanical properties. However, the growth of automotive electronics working at a higher temperature than consuming electronics, requires more reliable solder alloy during microelectronic packaging, which can be achieved by elemental alloying. In this work, the modified Sn-Ag-Cu alloy with Ni, Sb and Bi addition was soldered on the surface of NiSn, NiAu and NiPdAu coating layer respectively, and the effects of elemental addition on the interfacial microstructure and shear strength were investigated systematically. It was found that compared to the commercial SAC305 solder joint, the modified Sn-Ag-Cu solder joint has a thinner interfacial IMC layer while a higher shear strength under the same reflowing conditions, although the formed IMC species are all (Cu, Ni)₆Sn₅ at both the chip side and the printed circuit board (PCB) sides. The addition of Ni, Sb and Au elements can reduce the IMC growth rate, while the addition of Pd increases the IMC growth. For the same solder alloy and reflowing process, the thickness of IMC layer on NiPdAu is the largest, while that on NiAu coating layer is the smallest. Au or Pd addition in the coating layer affects the distribution of Ag₃Sn from dispersive particles to net-like morphology, resulting in an improvement of solder shear strength. The addition of Ag and Cu elements can increase the volume proportion of (Cu, Ni)₆Sn₅ and Ag₃Sn in the solder alloy, hence to increase the shear strength of the solder joints. The solution and precipitation of Bi in the solder alloy can also contribute to the higher shear strength of the modified Sn-Ag-Cu solder joint, although its melting point is decreased to about 213 ℃. Therefore, the shear strength of modified solder alloy with Ni, Sb and Bi elements is higher than that of commercial SAC305.

Key words： alloy element Sn-Ag-Cu solder intermetallic compound interfacial morphology shear strength

收稿日期: 2019-02-02

ZTFLH:

TF777.1

基金资助:国家重点研发计划项目(No.2017YFB0305700)

作者简介: 曹丽华，女，1966年生，副研究员

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https://www.ams.org.cn/CN/10.11900/0412.1961.2019.00033 或 https://www.ams.org.cn/CN/Y2019/V55/I12/1606

图1 S1~S3样品器件侧和印刷电路板(PCB)侧的截面SEM像

图2 S1~S3样品中Ag3Sn形貌的SEM像

图3 S2和M2样品截面SEM像

图4 S3样品的截面EPMA元素面扫描分布图

图5 S3样品器件侧IMC界面处的元素EDS线扫描分析

图6 M3样品的截面EPMA元素面扫描分析

图7 M3样品截面组织中Ag3Sn形貌的TEM像及SAED花样

图8 M3样品焊料中的Bi单质以及EDS分析

图9 焊膏M合金的DSC升温和降温曲线

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