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ZTAp/HCCI复合材料凝固过程中的温度场和热应力的数值模拟 |
种晓宇1,2, 汪广驰1,2, 杜军3, 蒋业华1,2(), 冯晶1,2 |
1 昆明理工大学材料科学与工程学院 昆明 650093 2 昆明理工大学金属先进凝固成形及装备技术国家地方联合工程实验室 昆明 650093 3 马鞍山钢铁股份有限公司技术中心 马鞍山 243000 |
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Numerical Simulation of Temperature Field and Thermal Stress in ZTAp/HCCI Composites DuringSolidification Process |
Xiaoyu CHONG1,2, Guangchi WANG1,2, Jun DU3, Yehua JIANG1,2(), Jing FENG1,2 |
1 School of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, China 2 National Engineering Laboratory of Advanced Metal Solidification/Forming and Technology of Equipment, Kunming University of Science and Technology, Kunming 650093, China 3 Technology Center, Magang (Group) Holding Co., Ltd., Ma'anshan 243000, China |
引用本文:
种晓宇, 汪广驰, 杜军, 蒋业华, 冯晶. ZTAp/HCCI复合材料凝固过程中的温度场和热应力的数值模拟[J]. 金属学报, 2018, 54(2): 314-324.
Xiaoyu CHONG,
Guangchi WANG,
Jun DU,
Yehua JIANG,
Jing FENG.
Numerical Simulation of Temperature Field and Thermal Stress in ZTAp/HCCI Composites DuringSolidification Process[J]. Acta Metall Sin, 2018, 54(2): 314-324.
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